Electronics enclosures with high thermal performance and related system and method
作者： Gary A. Clayton , Bruce C. Fitz-Patrick , Jr. Byron E. Short
DOI:
关键词: Fluid transport 、 Electronics 、 Cooling fluid 、 Thermal 、 Electronic component 、 Flow (psychology) 、 Mechanical engineering 、 Enclosure 、 Engineering
摘要: Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes electronics enclosure having multiple ribs (110, 226, 326, 426) configured to separate The also at least one fluid transport structure (208, 308, 408) encased within the (100, 218, 224). Each pipes (210, 310, 410) flow channels (212, 412, 502, 504, 506, 510-516, 518, 520, 606, 608). located of enclosure, from channels.
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