作者: George Shevchuk , Alfonso J. D'Alessio , Anthony R. Tancreto , Thomas F. Craft , Ivan Pawlenko
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摘要: An enclosure for electronic devices has a wall of rigid plastic material, with elongated chambers defined therein. The are filled material having high thermal conductivity, or materials heat capacity, such as phase change material. Each chamber is located so that the in contact at first location tends to be relatively temperature, and second lower temperature. may alternatively have pipes metal rather than chambers.