Arrangement of plural micro-cooling devices with electronic components

作者: Hans-Juergen Fuesser , Tim Gutheit , Wolfram Muench , Reinhard Zachai

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摘要: An arrangement of a plurality microcooling devices provided with electrical components, each device having closed channel structure for coolant to flow through, and being conductors the electronic components externally carried fluid ducts which flows through structures. A covering layer forms one at least two flat sides is made from an electrically insulating material good heat conductivity. The are arrayed on this cover opposite side device. Adjacent confronting arranged their spaced apart or staggered respect another, preferably in contact adjacent

参考文章(10)
Jack J. Rosenberg, Gasket for a hollow core module ,(1989)
Michael John Kellaway, Ross Martin Green, David John Shemmans, David James Mcshane, Mounting assembly for power semiconductors ,(1994)
Michael L. Zumbrunnen, Michael J. Ellsworth, Robert E. Simons, Richard Chao-Fan Chu, Gary F. Goth, Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels ,(1991)
Nobuhiko Fujita, Tadashi Tomikawa, Tsunenobu Kimoto, Semiconductor heterojunction structure ,(1990)
Alexander Kastalsky, Anatoly Grinberg, Semiconductor device based on charge emission from a quantum well ,(1987)
Bernd Dr Gromoll, Peter Gulden, Bertram Sachs, Microcooling device for an electronic component ,(1993)