Apparatus for semiconductor circuit chip cooling using a diamond layer

摘要: In a semiconductor device, thin, synthetic diamond film (i.e. man made film) enhances the transfer of heat from circuit chip to cooling medium. The generating is located in efficient thermal engagement with one surface synthetically deposited film. opposite forms bottom wall cavity that contains embodiment invention, formed by depositing on silicon substrate, and then etching substrate form an open-top having side walls comprise comprises second apertured preform bonded A capping member closes top cavity. medium placed within fluid may be circulated. through use inlet outlet are member.