Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
作者： Mario J. Paniccia
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摘要: An apparatus and method that permits the removal of heat from back side surface an integrated circuit semiconductor substrate while performing optical based testing through or at substrate. In one embodiment, present invention includes a device having infrared transparent slug attached to device. Heat is removed then thermally cooled by conventional cooling technique.
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