Electronic assembly and cooling thereof
作者： Krishna Seshan , Prosenjit Ghosh , Yves André Volckaert
DOI:
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摘要: An electronic assembly is provided. substrate of the has a plurality conductive lines to transmit signals, and cooling opening therethrough. The an inlet allow fluid into substrate, section in through which flows from inlet, outlet out substrate. A semiconductor die mounted circuit connected metal so that signals are transmitted between lines, operation causing heating die, heat being transferred where flowing section.
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