Multilayer interconnection substrate and method of manufacturing the same
作者： Tomoyuki Abe
DOI:
关键词: Optoelectronics 、 Interconnection 、 Materials science 、 Layer (electronics) 、 Substrate (printing) 、 Conductor 、 Electrical engineering
摘要: A multilayer interconnection substrate is disclosed that includes a layer having at least first and second stacked with an insulating provided therebetween, connection via configured to electrically connect the layer. The internal conductor metal film covering conductor. aggregate of particles.
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