Multi-layer flexible printed circuit board, and method for fabricating it
作者： Toyokazu Yoshino , Kouji Nakashima
DOI:
关键词: Micropatterning 、 Conductor 、 Solder ball 、 Ball (bearing) 、 Multi layer 、 Optoelectronics 、 Interconnection 、 Flexible electronics 、 Materials science 、 Electrical engineering
摘要: To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the layers in device; to a high-productivity method fabricating device. A board, wherein conductor is filled through-holes formed insulating layer direction of thickness thereof so as electrically interconnect on both faces layer, contains inside it, copper-core solder ball copper core thereof.
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