作者: S Taniguchi , A Kitahara , S Wakayama , E Eriguchi , N Suyama
DOI: 10.1016/S0168-583X(00)00655-8
关键词: Amorphous solid 、 Silicon 、 Composite material 、 Materials science 、 Transmission electron microscopy 、 Ion 、 Hardening (metallurgy) 、 Nanoindentation 、 Ion implantation 、 Metallurgy 、 Microstructure
摘要: Abstract The dual implantation of silicon and carbon ions into copper iron was carried out with an MeV ion accelerator. Analysis by transmission electron microscopy (TEM) revealed that the implanted layer a Cu substrate is crystalline, while Fe amorphous. hardness measured as function depth continuous stiffness measurement method nano indenter. Dual found to enhance substrate, peak occurred at smaller than concentration layer. Cross-sectional TEM images layers taken under indentations various showed indenter did not fracture layer, but rather deformed it plastically. These data provide us qualitative understanding hardening mechanism.