Dynamics of a pulsed DC discharge used for plasma-assisted chemical vapor deposition — a case study for titanium nitride deposition

作者: T.A. Beer , J. Laimer , H. Störi

DOI: 10.1016/S0257-8972(99)00486-7

关键词: CathodeMaterials scienceChemical vapor depositionPlasmaDielectric barrier dischargeOptoelectronicsLangmuir probeTitanium nitridePulsed DCAnalytical chemistryLight emission

摘要: Abstract An investigation of the development a pulsed DC discharge used for plasma-assisted chemical vapor deposition (PACVD) titanium nitride was carried out in order to understand non-uniform depositions larger PACVD systems. The temporal and spatial evolution plasma light emission studied by video camera. time potential single Langmuir probe current probe. In presence TiCl 4 formation across reactor is slow, reaching some parts with substantial delay. Our experiments show that depends on geometry cathode, which includes loading placement substrates, gas mixture waveform voltage supplied. slow spreading surface substrates are placed, leads non-uniformity power density front cathode as well spatially varying exposure plasma. revealed can be solved measures provide sufficient fall entire whereby high average currents have avoided.

参考文章(13)
K.-T. Rie, A. Gebauer, J. Woehle, Investigation of PA-CVD of TiN: Relations between process parameters, spectroscopic measurements and layer properties Surface & Coatings Technology. ,vol. 60, pp. 385- 388 ,(1993) , 10.1016/0257-8972(93)90118-8
Shizhi Li, Wu Huang, Hongshun Yang, Zhongshu Wang, Plasma chemical vapor deposition of TiN Plasma Chemistry and Plasma Processing. ,vol. 4, pp. 147- 161 ,(1984) , 10.1007/BF00566838
J. Laimer, H. Störi, P. Rödhammer, Titanium nitride deposited by plasma-assisted chemical vapour deposition Thin Solid Films. ,vol. 191, pp. 77- 89 ,(1990) , 10.1016/0040-6090(90)90276-J
J. Laimer, H. Störi, P. Rödhammer, Plasma‐assisted chemical vapor deposition of titanium nitride in a capacitively coupled radio‐frequency discharge Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 7, pp. 2952- 2959 ,(1989) , 10.1116/1.576173
K.S Mogensen, C Mathiasen, S.S Eskildsen, H Störi, J Bøttiger, The time development of pulsed-DC production plasmas used for deposition of TiN Surface & Coatings Technology. ,vol. 102, pp. 35- 40 ,(1998) , 10.1016/S0257-8972(97)00528-8
I︠u︡. P. Raĭzer, Gas Discharge Physics ,(1991)
Mitsuharu Konuma, Yasushi Kanzaki, Osamu Matsumoto, Titanium nitride deposition in an r.f. discharge Journal of The Less Common Metals. ,vol. 75, pp. 1- 5 ,(1980) , 10.1016/0022-5088(80)90362-8
J. Laimer, H. Karner, H. Störi, P. Rödhammer, Plasma-Enhanced Chemical Vapour Deposition of Coatings in the System Ti-B-N Materials Science Forum. ,vol. 140-142, pp. 439- 456 ,(1993) , 10.4028/WWW.SCIENTIFIC.NET/MSF.140-142.439
K.-T. Rie, Th. Lampe, S. Strämke, Neue Entwicklungen zur Herstellung von Hartstoffschichten mittles Plasma-CVD Materialwissenschaft Und Werkstofftechnik. ,vol. 17, pp. 109- 114 ,(1986) , 10.1002/MAWE.19860170308