Issues related to the implementation of Pb-free electronic solders in consumer electronics

摘要: Consumer electronic applications are the primary target of Pb-free initiative and package assembly performance is affected by move from eutectic Sn-Pb to solder alloys. This paper outlines key issues mitigation possibilities for using solders: High temperature reflow, Interfacial reactions, Reliability. At high temperatures required reflow alloys, moisture absorbed into can result in delamination failure. The reaction with Ni Cu metallizations results interfacial intermetallics that not significantly thicker than but provide a path fracture under mechanical loading due increased strength reliability discussed include thermomechanical fatigue, shock, electromigration whiskering. alloys tend improve fatigue detrimental shock Design trade-offs must be made successfully implement consumer applications.