Cu/Sn Solid-Liquid Interdiffusion Bonding

作者: A. Munding , H. Hübner , A. Kaiser , S. Penka , P. Benkart

DOI: 10.1007/978-0-387-76534-1_7

关键词:

摘要: … [7] and has gained significance in semiconductor bonding during the last decades. It has … ) bonding [30], and its beneficial properties are particularly prominent in the Cu–Sn system. …

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