Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding
作者： CC Li , ZX Zhu , LL Liao , MJ Dai , CK Liu
DOI: 10.1179/1362171813Y.0000000116
关键词:
摘要: Solid liquid interdiffusion technique is employed to attach N type Bi2(Te0·92Se0·08)3 thermoelectric material alumina substrate. The surface finishes of the bonding surfaces for and are Ni Ag respectively. layer pure Sn. growth kinetic intermetallic compounds their microstructure evolution during aging at 200°C was established. success this provides a cost effective way assemble modules low temperature higher applications.
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