Apparatus for indirect impingement cooling of integrated circuit chips

摘要: An integrated circuit thermal conduction module comprises a substrate having chip-carrying surface and at least one chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper of chip. piston has lower which urges conforms against contains open channel permitting coolant passage contact with for conveying heat from without direct between Preferably, central passageway extending along longitudinal axis channeling through piston, plurality channels radially outwardly face directing beneath piston.