Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source

摘要: A method and apparatus for selectively heating a structure capable of absorbing heat radiations in the 0.5 to 2 micron range relative an adjacent wherein first is disposed second much less range. An unfocused source which provides major portion its energy from about 0.5μ 2μ above below directs concurrently structures temperature sufficiently high higher then permit predetermined function be performed conjunction with while maintaining temperature. The performed. preferably comprises tungsten halogen lamp.