Spot Heat Wirebonding
作者： Yoshikatsu Umeda , Sohichi Kadoguchi , Norihiro Kawakami
DOI:
关键词:
摘要: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention described a wirebond including system components method steps generating electromagnetic energy from heat source transmitting to ball formed on bondwire. Subsequently, pressure applied at bonding site is used formation wirebond.
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