Rapid prototyping of silicon microstructures by means of a new masking process and crystal orientation dependent etching
作者： David Hilbig , Birgit Hannemann
DOI: 10.1016/J.SNA.2010.07.017
关键词: Optoelectronics 、 Dry etching 、 Materials science 、 Etching (microfabrication) 、 Silicon 、 Microelectromechanical systems 、 Machining 、 Lithography 、 Reactive-ion etching 、 Masking (art) 、 Engineering drawing
摘要: Abstract Silicon micromachining for MEMS components requires deep etching processes in combination with etch-resistant masks. The usual masking and lithographic procedures are expensive unsuitable fast layout changes. We developed a machining possibility, which combines the flexibility of laser direct writing shape quality crystal orientation dependent silicon. main step is substituting SiO 2 or Si 3 N 4 mask layers by metal films. These films can be directly patterned marking system followed well-known etch process KOH.
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