Silicon surface processing techniques for micro-systems fabrication
作者： Vygantas Mizeikis , Saulius Juodkazis , Jia-Yu Ye , Andrei Rode , Shigeki Matsuo
DOI: 10.1016/S0040-6090(03)00803-4
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摘要: Abstract Micromachining of silicon surface and near-surface regions by electron-beam lithography (EBL) reactive ion dry-etching (RIE), as well laser microfabrication techniques is described. Combination EBL RIE used to fabricate quasi two-dimensional (2D) photonic crystal (PhC) structures with aspect ratios at approximately 15. Structural optical properties PhC samples 2D honeycomb lattice are reported, a complete band gap wavelengths 2.16 μm identified from the transmission data. Next, femtosecond pulses reported. Processing under low air pressure conditions (≃5 Torr) demonstrated be essentially debris-free process, highly suitable for cutting scribing wafers hole drilling. Removal thin films single-shot ablation using mask projection also demonstrated.
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