A study of the mechanical reliability of a MEMS microphone

作者: Wenxiao Fang , Qinwen Huang

DOI: 10.1109/IPFA.2013.6599261

关键词: Finite element methodEngineeringMicrophoneAcousticsMems microphoneDiaphragm (acoustics)Structural engineeringMicroelectromechanical systemsMechanical reliabilityPlane (geometry)Acceleration

摘要: This paper describes a failure analysis on commercial MEMS microphone after test according to the standard of Mil-Std-883. With help and finite element simulation, we find that studied part can survive stress limit above 20000g normal diaphragm plane. Under constant acceleration high 30000g, breaks devices fail.

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