作者: J. Bergqvist , F. Rudolf
DOI: 10.1016/0924-4247(90)85023-W
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摘要: A diaphragm, machined in lightly doped silicon, is the principal component of a new capacitive microphone designed to operate with an external bias voltage. The concept aims towards design which can be highly miniaturized and fabricated at low cost IC- compatible technology. significant points are stray capacitances ( < 0.5 pF), large number ventilation holes back plate allowing small air gap (4 μm), integrated chamber. frequency response has been calculated using mechano-acoustical lumped parameter model. Finally, chips overall size 3 × 4 1.3 mm3 have preliminary measurements demonstrated open- circuit sensitivities between 1.4 13 mV/Pa, corresponding bandwidths 16 kHz.