A new hybrid fabrication process for a high sensitivity MEMS microphone
作者： Paul C.-P. Chao , Chun-Yin Tsai , Chi-Wei Chiu , Che-Hung Tsai , Tse-Yi Tu
DOI: 10.1007/S00542-013-1829-5
关键词:
摘要: … The capacitance value is first predicted by COMSOL, which is accomplished using the 3D … of the parallel plates, C, is calculated from the COMSOL, as shown in Fig. 2. It shows the …
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