Finite-element modelling and characterization of a silicon condenser microphone with a highly perforated backplate

作者: J. Bergqvist

DOI: 10.1016/0924-4247(93)80219-7

关键词: Electrical engineeringAir gap (plumbing)Capacitive sensingFrequency responseAcousticsBiasingEquivalent circuitMonocrystalline siliconFinite element methodEngineeringMicrophone

摘要: Abstract A new method to simulate the sensitivity and frequency response of capacitive microphones has been developed. Finite-element analysis is used in combination with equivalent circuits evaluate mechanical, electrostatic acoustic effects. The simulation applied a condenser microphone monocrystalline silicon. design thin highly perforated backplate small air gap 2 μm. Sensitivities range 1–5 mV/Pa have recorded bias voltage between 5 13 V. device first resonance at 27 kHz. measured results are good agreement obtained method.

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