Theoretical and experimental studies of single-chip-processed miniature silicon condenser microphone with corrugated diaphragm
作者： Quanbo Zou , Zhijian Li , Litian Liu
DOI: 10.1016/S0924-4247(97)80507-9
关键词:
摘要: Abstract A miniature single-chip-processed silicon condenser microphone with a corrugated diaphragm has been developed. The highly sensitive 1 mm2 in area and rigid backplate is fabricated single-chip process. finite-element method (FEM) equivalent-circuit have used to evaluate the mechanical acoustic performance. Diaphragms different corrugation configurations are simulated tested, an optimized structure of high sensitivity achieved. Microphone sensitivities range 9.6–14.2 mV Pa−1 recorded under bias voltages 10–20 V, good reproducibility. frequency bandwidth devices between 9 16 kHz. results agreement experiments.
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