Evaluation and Measurement of Surface/Subsurface Crack Damage of Ground Ceramics
作者： Bin Lin , Hong Tao Zhu , Hui Wu , Z.F. Wang , S.Y. Yu
DOI: 10.4028/WWW.SCIENTIFIC.NET/MSF.471-472.47
关键词: Crack closure 、 Grinding 、 Brittleness 、 Geotechnical engineering 、 Layer (electronics) 、 Materials science 、 Surface (mathematics) 、 Ceramic
摘要: While be ground, ceramic is prone to engender surface/subsurface crack damage layer because of great grinding force and high brittle the material. The was investigated in this research. In experiment, it observed that consists three kinds cracks: surface micro-cracks, macro-cracks subsurface system. To evaluate expediently degree machined components, index - Dc, defined.
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