Apparatus for direct transfer of semiconductor device die
作者： Andrew Huska , Cody Peterson , Clinton Adams , Sean Kupcow
DOI:
关键词: Die (integrated circuit) 、 Optoelectronics 、 Substrate (printing) 、 Semiconductor device 、 Rotation 、 Collet 、 Wafer 、 Direct transfer 、 Transfer (computing) 、 Materials science
摘要: A semiconductor device die transfer apparatus includes a first frame to hold wafer tape having plurality of disposed on side the and second secure product substrate circuit trace thereon. The is configured such that facing tape. Additionally, rotary collet between substrate. has rotational axis allowing rotation from position pick release die, thereby applying directly during operation.
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