Bowl for processing semiconductor wafers

作者: Brian M. Bliven , Roy Winston Pascal

DOI:

关键词: Surface (mathematics)MathematicsOpticsSemiconductorProjection (mathematics)GeometryWafer

摘要: A bowl includes a bottom wall having generally circular shape. sidewall extends upwardly from the to define cylindrical chamber. The has projection that into top surface defines step in chamber and sloped between an inner of sidewall. is slightly downwardly. oriented relative such extensions angle range about 30 degrees 45 degrees. spin, rinse, dry module including method for loading semiconductor wafer also are described.

参考文章(30)
D'arcy Lorimer, Edward Baker, Kang Ho Ahn, Benjamin Y.H. Liu, Apparatus and method for particle removal by forced fluid convection ,(1990)
Greg Montanino, Bruce L. Hayes, Spin coating bowl ,(1998)
Toshitaka Takei, Tsunemasa Funatsu, Resist developing apparatus ,(1986)
o Mitsubishi Materials Takahasi, O Mitsubishi Materials Tsutsumi, Keisuke c, Tatsumi c, o Mitsubishi Materials Koyama, Mitsuzi c, Yukio C, o Mitsubishi Materials Matsumoto, Wafer binding method and apparatus ,(1991)
Koji Ueda, Hideya Kobari, Ryuzo Takatsuki, Hidenori Miyamoto, Hiroyoshi Sago, Rotary chemical treater having stationary cleaning fluid nozzle ,(1995)
Hidetami Yaegashi, Hiroyuki Matsukawa, Takashi Takekuma, Takahide Fukuda, Michiaki Matsushita, Akira Yonemizu, Akihiro Fujimoto, Double-sided substrate cleaning apparatus ,(1994)
Hideya Tanaka, Minoru Kubota, Kenichi Miyamoto, Walter Swanson, Apparatus and method for washing substrate ,(1997)