Ultrasonically enabled low tempertaure electroless plating for sustainable electronic manufacture
作者： A J Cobley , J E Graves , B Mkhlef , B Abbas , T J Mason
DOI: 10.1109/ESTC.2012.6542132
关键词: Electroless plating 、 Low frequency ultrasound 、 Metallurgy 、 Copper plating 、 Copper 、 Materials science 、 Operating temperature
摘要: Electroless copper plating is an important process for the metallization of non-conductive substrates and therefore widely utilized throughout electronics industry. processes are characterised by high temperature operation although effect ultrasound on electroless has been studied many years, its use as enabling technology to reduce operating not investigated. In this study a catalysed was it found that low frequency under optimised conditions can lead reduction in temperature.
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