Megasonic agitation for enhanced electrodeposition of copper
作者： Jens Georg Kaufmann , Marc P. Y. Desmulliez , Yingtao Tian , Dennis Price , Mike Hughes
DOI: 10.1007/S00542-009-0886-2
关键词: Electrical engineering 、 Surface-mount technology 、 Plating 、 Acoustics 、 Flip chip 、 Acoustic streaming 、 Nernst equation 、 Diffusion layer 、 Electroplating 、 Materials science 、 Acoustic wave
摘要: In this paper we propose an agitation method based on megasonic acoustic streaming to overcome the limitations in plating rate and uniformity of the metal deposits during the …
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researchgate.net 参考文章(9)
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