Integrated circuit systems including vertical inductors
作者： Rasit O. Topaloglu
DOI:
关键词: Substrate (electronics) 、 Integrated circuit 、 Inductor 、 Materials science 、 Electrical engineering
摘要: An integrated circuit system is provided that includes a function in and on surface of semiconductor substrate. First second portions an inductor overlie the substrate each coupled to first function. A third portion positioned through via (TSV) extends electrically couples TSV portion.
google.de 参考文章(14)
Arvind Swarup, Printed lumped element stripline circuit ground-signal-ground structure ,(1997)
Lew G. Chua-Eoan, Seyfollah S. Bazarjani, Thomas R. Toms, Shiqun Gu, Matthew Nowak, Jonghae Kim, Brian Matthew Henderson, Three dimensional inductor and transformer ,(2010)
Chang-Chih Liu, Chang-Sheng Chen, Li-Chi Chang, Yung-Chung Chang, Cheng-Hua Tsai, Three dimensional inductor ,(2011)
Edward Belden Harris, Kurt George Steiner, Sailesh Mansinh Merchant, Susan Clay Vitkavage, Inductor formed in an integrated circuit ,(2004)
Yipeng Yan, Robert James Bogert, Magnetic Electrical Device ,(2009)
Robert A. Groves, Arne W. Ballantine, Anthony K. Stamper, Michael B. Rice, Spiral inductor semiconducting device with grounding strips and conducting vias ,(2001)
David L. Thompson, Gregory J. Haubrich, Implantable medical device incorporating miniaturized circuit module ,(2003)
James A. Walls, Electrical component having an inductor and a method of formation ,(2006)
Chin-Sun Shyu, Chang-Lin Wei, Kuo-Chiang Chin, Syun Yu, Cheng-Hua Tsai, Tunable embedded inductor devices ,(2008)
David Clifford Long, Harvey Charles Hamel, Harsaran S. Bhatia, Edward R. Pillai, Benjamin Paul Tongue, Christopher David Setzer, Embedded inductor and method of making ,(2001)