Inductor formed in an integrated circuit

作者: Edward Belden Harris , Kurt George Steiner , Sailesh Mansinh Merchant , Susan Clay Vitkavage

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摘要: An inductor formed within an integrated circuit and a method for forming the inductor. The comprises underlying layer of aluminum in first metallization patterned etched into desired shape. In one embodiment line spiral According to damascene process, conductive runner, preferably copper, is dielectric overlying electrical contact therewith. runner cooperate form another are vertically spaced-apart orientation, with tungsten plugs or vias provide connection therebetween. A over line.

参考文章(19)
Daniel Charles Edelstein, Christopher Vincent Jahnes, Cyprian Emeka Uzoh, Joachim Norbert Burghartz, Integrated circuit spiral inductor ,(1997)
Chi-Wu Chou, Chun-Hon Chen, Ssu-Pin Ma, Kuo-Reay Peng, Heng-Ming Hsu, Ta-Hsun Yeh, Yen-Shih Ho, Kong-Beng Thei, Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow ,(2000)
Douglas H. Weisman, Robert E. Stengel, Ronald C. Alford, George W. Marlin, Method of forming a three-dimensional integrated inductor ,(1998)
Choon-Beng Sia, Toe Naing Swe, Alex See, Chen Yeow Ng, Kiat Seng Yeo, Parallel spiral stacked inductor on semiconductor material ,(2003)
Richard B. Merrill, Enayet U. Issaq, Multi-turn, multi-level IC inductor with crossovers ,(1995)
Herve Jaouen, Michel Marty, Transformer for integrated circuits ,(1998)
Chia-Hung Chin, Chien-Chou Hung, Ellis Lin, Cheng-Wen Fan, Tsun-Lai Hsu, Hua-Chou Tseng, Method of fabricating inductor and structure formed therefrom ,(2004)