Ball grid array stack
作者： Frank Mantz
DOI:
关键词: Electronic component 、 Stack (abstract data type) 、 Flip chip 、 Optoelectronics 、 Ball grid array 、 Interposer 、 Materials science 、 Electrical conductor 、 Die (integrated circuit) 、 Electronic engineering 、 Electrical connection
摘要: The invention discloses a device comprising stack of at least two layers, which may comprise active or passive discrete components, TSOP and/or ball grid array packages, flip chip wire bonded bare die the like, layers are stacked and . interconnected to define an integral module. A first second layer electrically conductive trace with one more electronic components in electrical connection therewith. traces terminate lateral surface each access lead. An interposer structure is disposed between provides upon interconnect defined create predetermined leads on layers.
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