Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package

摘要: There are provided a semiconductor device mounting board, method of manufacturing the same, inspecting and package in which by improving conventional wiring board is capable implementing high-density fine structure corresponding to narrowing pitch has high reliability. A characterized comprising construction film including an insulating layer layer, first electrode pattern disposed on one surface periphery side contact with at least rear not plane exists; second opposing pattern, insulator opening can be housed disposed, metallic supporter surface.