Circuit board for semiconductor device inspection apparatus and manufacturing method thereof
作者： Hisatomi Hosaka , Jun Mochizuki , Tomohisa Hoshino
DOI:
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摘要: A circuit board for a semiconductor device inspection apparatus can have small thermal expansion coefficient and high mechanical strength be easily manufactured with reduced manufacturing cost. Furthermore, the includes metal base body obtained by stacking bonding multiple number of plates, each having through hole formed an etching, such that holes plates are overlapped other to form hole; resin layer on surfaces inner wall surface body; conductor pattern electrically insulated from layer.
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