Semiconductor device and method of measuring the same
作者： Tadahiko Sato
DOI:
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摘要: A semiconductor device includes first and second contact parts that are disposed close to each other with an interval therebetween form a screw hole (connection area) which external connection terminal is connected. The part extends from side of case via linkage the side, side. away by at least certain interval. In this way, allowed have chips connected in parallel function as device. addition, electrical characteristics individually measured.
lens.org 参考文章(20)
Hisatomi Hosaka, Jun Mochizuki, Tomohisa Hoshino, Circuit board for semiconductor device inspection apparatus and manufacturing method thereof ,(2013)
Forrest Irving Kinsey, Douglas John Hardy, John Mark Myer, John Raymond Shuey, Ground terminal assembly for a vehicle ,(2011)
Yuichi Machida, Manufacturing method for semiconductor devices ,(2011)
Bruce B. Doris, Charles W. Koburger, Kangguo Cheng, Parasitic capacitance reduction in mosfet by airgap ild ,(2011)
Takatoshi Yasui, Atsuhiro Kajiya, Semiconductor device and method for evaluating characteristics of the same ,(2004)
Motoo Suwa, Atsushi Nakamura, Hideshi Fukumoto, Yuichi Mabuchi, Semiconductor device and an electronic device ,(2002)
Kazuhiko Nimura, Tetsuya Shinozaki, Hiroyuki Matsuoka, Mounting structure of terminal fitting ,(1996)
Taketo Kunihisa, Kaoru Muramatsu, Toshio Fujiwara, Masaaki Nishijima, Takahiro Yokoyama, Shinji Yamamoto, Junji Itoh, Osamu Ishikawa, RF-driven semiconductor device ,(1997)
Xiaonan Wen, Wenzhuo Wu, Zhonglin Wang, Transistor array and manufacturing method thereof ,(2013)
Yasuo Takemoto, Tetsuya Yamamoto, Storage medium and semiconductor package ,(2009)