Bga package, test socket therefor and test for bga package

摘要: PROBLEM TO BE SOLVED: To provide a ball grid array(BGA) package, test socket therefor and method for testing the BGA which can avoid influences of an interval area inspection pads, even when size soldering bumps in package are made small. SOLUTION: An IC chip 11 is mounted on front surface printed circuit board 12 connected with wiring lines 13 (on side board) by bonding wires 16. The through hole 14 to rear board, 15. Further, extended up faces 12, Ni plated layer 19 Au 20 formed. These parts electrically electrode pads 11a 15, rear-side 13, through-hole 14, front-side 16 respectively, act as pads.