Packaged electronic devices having die attach regions with selective thin dielectric layer
作者： Bernardo Gallegos , Kenji Masumoto
DOI:
关键词:
摘要: A method for forming a packaged electronic device including package substrate having top surface die attach region at least one land pad thereon and first dielectric layer positioned lateral to the non-die region. second is formed on of substrate. An IC which mounted underfill between
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