Method for producing multilayer wiring board and multilayer wiring board
作者： Yoshitaka Okugawa , Hitoshi Aoki , Kensuke Nakamura , 良隆 奥川 , Hiroyuki Sawai
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摘要: PROBLEM TO BE SOLVED: To provide a multilayer wiring board, having not only rigidity but also superior heat dissipation characteristic and noise characteristic. SOLUTION: The method for manufacturing board comprises step forming resist metal layer pattern, using plate as lead electrolytic plating; removing the by etching, frame 116 on outermost of 113 partially etching 101b which is used at formation side 113, mounting semiconductor chip 202.
lens.org 参考文章(1)
Yasuyoshi Horikawa, Akira Fujisawa, Masayuki Sasaki, 泰愛 堀川, 正行 佐々木, Akio Mutsukawa, 昭雄 六川, 晃 藤沢, Multilayer wiring board, manufacture thereof, and semiconductor device ,(1999)