Wiring structure of circuit board and its formation

摘要: PROBLEM TO BE SOLVED: To form a fine circuit wiring of high density by improving adhesion between wiring, and base board an insulation layer preventing metal from diffusing to circumferential generating migration. SOLUTION: When required conductor is on seed for plating lead applied or semiadditive method, the 2 formed material which different that 4, conductive coating 6 same in outer circumference 4 enclosing 7 4.