WIRING BOARD AND MANUFACTURING METHOD THEREOF
作者： Nishimoto Akihiko
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摘要: PROBLEM TO BE SOLVED: To improve high frequency characteristic and close contact of wiring layers also to prevent deterioration insulation resistance for reduction pitch between wires wiring. SOLUTION: The board is provided with an insulating layer 15 including at least resin a 11. At part the 11 includes covering structure consisting main 11a metal 11b having composition which different from that entire circumference 11a. COPYRIGHT: (C)2006,JPO&NCIPI
lens.org 参考文章(5)
Masakatsu Mori, Toshihiro Makino, Takashi Hasegawa, 敏弘 牧野, 弘基 出嶌, Hiromoto Dejima, 陸宏 常門, Michihiro Tsunekado, 征克 森, 長谷川 隆, Irreversible circuit element and communication unit ,(2000)
Shoji Takano, 祥司 高野, Mitsusachi Mikami, 光幸 三上, Wiring structure of circuit board and its formation ,(1995)
Ueda Masaaki, MULTILAYER WIRING BOARD AND ITS MANUFACTURE ,(2000)
勲夫 平田, 光司 高木, Hiroaki Fujiwara, Satoru Ogawa, 弘明 藤原, 清暁 井原, Koji Takagi, Isao Hirata, Shinichi Iketani, 悟 小川, 政行 石原, Shuji Maeda, 晋一 池谷, 修二 前田, Masayuki Ishihara, Shoichi Fujimori, 義廣 中川, 正一 藤森, Kiyoaki Ihara, Yoshihiro Nakagawa, Multilayer wiring board and manufacture thereof ,(1997)
和昭 佐藤, Kenji Iida, 憲司 飯田, Kazuaki Sato, Forming method of conductor pattern ,(1991)