Semiconductor multi-package stack
作者： Seung Kon Mok , Ki Won Choi , Seung Ho Ahn
DOI:
关键词: Lead frame 、 Printed circuit board 、 Semiconductor chip 、 Optoelectronics 、 Substrate (printing) 、 Materials science 、 Electrode 、 Stack (abstract data type) 、 Electrical engineering 、 Semiconductor
摘要: A stacked semiconductor multi-package including a plurality of individual chip packages over one another. The have substrate provided with bonding pads, electrode pads electrically connected to the through wires, and chips attached upper lower surfaces substrate. paddles lead frame is onto which are thereof, variants thereof. For these packages, since mounted on single printed circuit board or frame, mounting density can be significantly increased their production simplified.
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