Multi-chip semiconductor package

摘要: A pair of DRAM chips 1A and 1B are mounted opposedly to each other with wiring means such as lead frames put therebetween, the being substantially integral external terminals 3B. Then, these connected together by conventional wire bonding method. Each chip is bonded an associated frame disposed plural conductors contacting mutually similarly function pads, i.e. chips, one chips. Ones or pairs thus-connected stacked corresponding leads in common form a laminate. The thus activated selectively accordance predetermined selection signal. Additionally, partial capable partially functioning normally combined utilizing above mounting method constitute single package.