Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
作者： Yoshihiro Bessho , Yoshihiro Tomura
DOI:
关键词: Printed circuit board 、 Semiconductor 、 Electrode 、 Optoelectronics 、 Engineering 、 Abrasive 、 Terminal (electronics) 、 Semiconductor device 、 Front and back ends 、 Grind 、 Electrical engineering
摘要: According to the present invention, a method for forming bumps electrically connecting electrode pads of semiconductor device terminal electrodes formed on surface circuit board respectively, being mounted facedown board, includes: step pad device: b placing flat foundation so that contact with grind sheet which is fixed and has abrasive grind; c conducting ultrasonic vibration while pressing against foundation, thereby rugged side in front end portion each bumps.
google.nl 参考文章(14)
Donald Francis Boyle, Ultrasonic metallic sheet-frame bonding ,(1969)
Georges E. Florens, representative Georges A. L. Souquet, Philippe Jourdain, Method of simultaneously manufacturing multiple electrical connections between two electrical elements ,(1981)
Theodore Alan Fulton, Greg E. Blonder, Semiconductor integrated circuit chip-to-chip interconnection scheme ,(1989)
B Cranston, Explosive bonding of workpieces ,(1971)
Toru Ishida, Toshio Tsuda, Yasuhiko Horio, Yoshihiro Bessho, Electrical contact bump and a package provided with the same ,(1988)
Takeshi Wakabayashi, Shigeru Yokoyama, Akira Suzuki, Method for forming a bump electrode for a semiconductor device ,(1990)
Takashi Tsumagari, Nobuo Ochiai, Method for manufacturing semiconductor strain sensor ,(1986)
Harvey Dow Gibson Scheffer, Ultrasonic wire bonding chuck ,(1972)
Arthur H. Mones, James E. O'Keefe, Method of protecting bumped semiconductor chips ,(1977)
Tetsuo Ando, Koichiro Atsumi, Formation of bump ,(1985)