作者: Tongbi Jiang
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摘要: The present invention includes electrical interconnections, methods of conducting electricity, and reducing horizontal conductivity within an anisotropic conductive adhesive. In one embodiment, interconnection configured to electrically couple a first substrate second includes: bond pad the having male configuration; female configuration, being mate with during connection pads substrate. A method electricity according providing individually defining planar dimension; coupling at interface surface area greater than between following coupling.