Surface mountable integrated circuit package with low-profile detachable module

摘要: A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The includes a chip having leads along its sides that are surface-mountable type, and plurality connectors at ends. module provided which contains components sensitive to solder temperatures or chemicals used in soldering process; examples such include batteries quartz crystal resonators. may be disposed directly over or, order reduce height system, one both outside outline package. has extending therefrom mate with on package, removably connected after board. Mechanical connection by snap members from engage surfaces when mounted thereto. Lockout tabs prevent improper electrical connection.