Apparatus for electrically mounting an electronic device to a substrate without soldering
作者： Thomas P. Glenn
DOI:
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摘要: An apparatus for mounting an electronic device on a substrate without soldering is disclosed. The includes body and plurality of cantilever beams extending from the body. mounted substrate. placed within apparatus. In one embodiment, press against device. another engage presses array electrical contacts (e.g., interconnection balls) corresponding metal pads substrate, thereby forming connection.
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