Novel 77 GHz flip-chip sensor modules for automotive radar applications
作者： T. von Kerssenbrock , P. Heide
DOI: 10.1109/MWSYM.1999.779477
关键词: Surface-mount technology 、 Lidar 、 Engineering 、 Flip chip 、 Electrical engineering 、 Intelligent sensor 、 Automotive industry 、 Key (cryptography) 、 Electronic engineering 、 Radar 、 Warning system
摘要: Radar is the key technology for future automotive distance warning systems. Cost and production issues are still major inhibitor to development of this market. This paper reports on a new 77 GHz sensor module based state-of-the-art MMICs flip-chip technology. The implemented completely coplanar design very attractive in terms simplicity.
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