Generic, Direct-Chip-Attach MEMS packaging design with high density and aspect ratio Through-Wafer Electrical Interconnect
作者： Seong Joon Ok , J. Neysmith , D.F. Baldwin
DOI: 10.1109/ECTC.2002.1008099
关键词: Integrated circuit 、 Integrated circuit packaging 、 Wafer 、 Electronic packaging 、 Chip-scale package 、 Microelectromechanical systems 、 Engineering 、 Microsystem 、 Electronic engineering 、 Wafer-scale integration
摘要: Micro-Electro-Mechanical-Systems (MEMS) are integrated systems combining electrical and mechanical components, which fabricated using circuit (IC) batch processing techniques. The influence of MEMS is made possible through their benefits in functionality, size, reliability. In spite these remarkable promising achievements the field microsystem fabrication, commercialization proven devices lagged far behind expectations, considerably due to high packaging cost, improper design solution testing cost. This paper focused on suggesting demonstrating a generic, modular, Direct-Chip-Attach (DCA), low cost reliable strategy applying with aspect ratio Through-Wafer Electrical Interconnect (TWEI). Fabrication TWEI dry etching relatively new technology that can create more better options than any other conventional design. various techniques make through-wafer vias conductive demonstrated analyzed advantages drawbacks.
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