In situ electro-mechanical experiments and mechanics modeling of tensile cracking in indium tin oxide thin films on polyimide substrates
作者： Cheng Peng , Zheng Jia , Dan Bianculli , Teng Li , Jun Lou
DOI: 10.1063/1.3592341
关键词: Fracture toughness 、 Composite material 、 Fracture mechanics 、 Materials science 、 Flexible electronics 、 Electrical resistance and conductance 、 Toughness 、 Polyimide 、 Indium tin oxide 、 Thin film
摘要: … in situ electro-mechanical experiments and mechanics modeling to decipher the failure mechanics of ITO thin films on … Our mechanics model offers quantitative determination of critical …
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