Defect analysis and mechanical performance of plasma-deposited thin films on flexible polycarbonate substrates

摘要: Abstract A simple solvent-etch based technique is developed to visualize and quantify defects in transparent thin films deposited on flexible polymer substrates. This approach used characterize as-deposited monitor their evolution as a function of applied repetitive bending. Thin investigated include sputtered indium tin oxide (ITO) alumina–silicone nanolaminates fabricated by plasma-enhanced chemical vapor deposition. It shown that the use nanolaminate architectures reduces defect density two orders magnitude relative single alumina layer. The pinhole increases when are subjected stress, at critical ∼10/mm 2 isolated coalesce into macroscopic cracks. In case ITO an optimum film thickness identified balances electronic performance with mechanical integrity. Conductivity correlates density, displayed very similar under tensile compressive strain. radius curvature 0.75 in. was identified, but cycled below threshold strain demonstrated robust performance, only negligible changes resistivity through 2000 bending cycles. strong attributed amorphous nature ITO.