Microscopic spallation mechanisms induced by a pulse laser at the solid-state interface

摘要: This paper presents a study of the transient behavior structural dynamics and associated innovatory microscopic spallation mechanism at solid-state interface, induced by an incident femtosecond pulse laser. By detailed dynamic analysis, using technique molecular simulation, solid–solid interface is observed. The occurrence mainly characterized extraordinary expansion tensile stress that induces interior void defect coalescence, eventually leading to cracking. phenomenon moderate ductile fracturing identified. A high strain rate in order 109 s-1 Both aforementioned phenomena are analogous experimental results metal-film excited Moreover, it also shown critical value stain one dominant factors influences spallation. simulations reveal thin-film structure safe if below certain values. damage threshold evaluated technical suggestions avoid interfacial fracture presented.